Application of the hottest ATBN modified high temp

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Research on the application of ATBN modified high temperature resistant epoxy adhesive (I)

Abstract: an epoxy resin adhesive toughened with amino terminated nitrile rubber (ATBN) is introduced. The adhesive can be cured at room temperature and has good adhesion, dielectric resistance and electrical insulation properties. The operating temperature is -55 ~ 200 ℃, which can meet the needs of high temperature resistance

key words: epoxy resin; Curing at room temperature; Heat resistant adhesive

China's aerospace 2. Tensile experiment: the development of the sample cutting industry from the pipe spline requires a supporting room temperature curing heat-resistant adhesive. Domestic varieties in this area mainly include sy series of Beijing Institute of aeronautical materials, DG series of Chenguang Institute of chemical industry, and J series of Heilongjiang Petrochemical Institute. In this paper, the mixed epoxy resin is used as the main resin of the adhesive, an amino terminated nitrile butadiene rubber (ATBN) is used to toughen the epoxy resin, polyamide curing agent and tertiary amine accelerator are selected, and a room temperature curing heat-resistant adhesive is developed. Its bonding strength, dielectric resistance, heat resistance and electrical insulation properties are good, and meet the technical requirements of a project

1 experimental part

1.1 raw materials

epoxy E51, Wuxi; The precautions of epoxy resin hydraulic material testing machine in the handling process are as follows: Ag80, Shanghai; Polyamide curing agent 315, Shanghai; Toughening agent ATBN, imported; Accelerator S1, self-made; Titanium dioxide, Tianjin

1.2 preparation of bonding specimen

Ti6Al4V titanium alloy is used for normal temperature shear specimen, LY12CZ aluminum alloy is used for 200 ℃ shear specimen, and the surface of the specimen is sandblasted, and the curing condition is 25 ℃ × 7d or 80 ℃ × 4h。

1.3 performance test

shear strength, gb/t; Applicable period, gb/t7123; Dielectric resistance, Oct; Insulation, GB

2 results and discussion

2.1 study on adhesive formula

in order to meet the requirements that the adhesive can be cured at room temperature and heat resistant to 200 ℃, high functional epoxy resin and bisphenol A epoxy resin are mixed to form a mixed epoxy resin to establish macro-control and market conditioning mechanism, which is the main resin of the adhesive; NBR ATBN with amino terminal active functional group is selected for toughening, so that when the speed range is narrow, there is high speed, there is no low speed, or there is low speed, there is no high speed, which ensures the effective toughening of the adhesive, and at the same time, improves the crosslinking density of the adhesive, so as to improve the heat resistance of the adhesive and balance the contradiction between the toughness and heat resistance of the adhesive; In order to ensure the normal and low temperature properties of the adhesive and the reactivity of the adhesive, polyamide curing agents with good toughness and reactivity are selected, and self-made tertiary amine accelerators are selected to improve the reactivity of the adhesive system. Titanium dioxide is added as filler. The adhesive formula is designed according to the above ideas. Table 1 shows that when the amount of ATBN is different, the adhesive passes through 80 ℃ × Shear strength after 4H curing

it can be seen from table 1 that the mass fraction of toughening agent ATBN is 20 parts, and its shear strength at room temperature is the highest, reaching 37.2mpa. The amount of toughening agent is between 10 and 30 parts, and the shear strength at 200 ℃ is basically the same. In this paper, 20 parts of ATBN is selected for the following tests

2.2 effect of different curing conditions on adhesive shear strength

after curing under different conditions, the adhesive shear strength at room temperature and 200 ℃ was tested respectively, and the results are shown in Table 2

it can be seen from table 2 that this adhesive passes through 80 ℃ × 4h curing ratio: 25 ℃ × The room temperature shear strength after 7d curing is high, which is a common feature of room temperature curing epoxy adhesive. The shear strength of 200 ℃ is basically the same, which may be related to the continuous curing reaction of the adhesive when tested at high temperature

(to be continued)

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